Sign In | Join Free | My ecer.jp
China Guangzhou Zhengqi Technology Co., Ltd. logo
Guangzhou Zhengqi Technology Co., Ltd.
Guangzhou Zhengqi Technology Co., Ltd. Guangzhou Zhengqi Technology Co., Ltd. is a national high-tech enterprise with core patented technology that provides products and services globally. Lt
Verified Supplier

2 Years
Home > Glue Potting Machine >

D&H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry

Product Categories
Guangzhou Zhengqi Technology Co., Ltd.
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now

D&H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry

Brand Name : D&H

Model Number : GOB

Certification : ce

Place of Origin : CHINA

MOQ : 1

Packaging Details : standard wood case

Contact Now

D&H GOB Lamination Production Line
——Tailored Solutions for Precision LED Manufacturing

----------------------------------------------------------------------------------------------------------------------------------

Overview
The D&H GOB (Glue on Board) Encapsulation Production Line offers fully customization solutions to meet diverse industrial needs, combining advanced encapsulation technology with modular design. Our production line prioritizes flexibility, enabling adjustment in size, mold configurations, software integration, and process parameters to align with specific client requirements.
Customizable Services

1. Production Line Dimensions
a. Scalable layouts to fit factory spaces ranging from compact workshops to large-scale facilities.
b. Adjustable conveyor widths (e.g., 500–2000 mm) and modular station placements for seamless integration with existing workflows.


2. Mold & Tooling Customization
a. Material Compatibility: Molds compatible with nano-grade adhesives, UV-resistant resins, or specialty coatings for
b.anti-glare/anti-static finishes.
c. Precision Design: Custom cavity shapes and surface textures (matte/gloss) to optimize encapsulation uniformity.


3. Software & Automation
a. Programmable Logic Control (PLC): Tailored dispensing algorithms for variable glue thickness and curing cycles.
b. AI-Driven Quality Monitoring: Real-time defect detection (<0.01% error rate) via adaptive AOI systems and predictive
maintenance alerts.


4. Process Parameters
a. Adjustable plunger pump pressure, flow rates, and nozzle configurations to accommodate low/high-viscosity adhesives.
b. Custom IP rating protocols and environmental stress-testing workflows.



----------------------------------------------------------------------------------------------------------------------------------

Applications
Ideal for bespoke projects requiring:
✔ High-mix, low-volume LED displays
✔ Specialized environments with strict durability standards.
Company Profile
D&H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry
D&H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry
D&H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry
D&H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry
Certifications
D&H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry
Why Choose Us
D&H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry

Product Tags:

Modular GOB Bonding Equipment

      

Energy Saving GOB Bonding Equipment

      

Electronics Industry GOB Bonding Equipment

      
Quality D&amp;H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry wholesale

D&H LED Solution Modular GOB Bonding Equipment Energy Saving Design For LED / Electronics Industry Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: Guangzhou Zhengqi Technology Co., Ltd.
*Subject:
*Message:
Characters Remaining: (0/3000)
 
You May Like